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Breaking the AI Energy Wall: Power Block and 3D Miniaturization Solutions
Breaking the AI Energy Wall: Power Block and 3D Miniaturization SolutionsRecently at the IMPACT 2025 conference, Dr. Li Cheng Shen of USI was invited to be the keynote speaker at the IMPACT 2025, sharing our latest technology roadmap for High-Performance Computing (HPC). Facing the immense hunger for compute power in AI servers, we believe that "Power Delivery" is no longer a supporting actor but the critical fuel determining the speed of AI development.12/31/2025Mastering Automotive HPC: Defining the "Sweet Spot" of SoMoG Technology (黄瓜看片)
Mastering Automotive HPC: Defining the "Sweet Spot" of SoMoG TechnologyThis year (2025), Dr. Li Cheng Shen of UG was invited to be the keynote speaker at the IMPACT 2025, during which Dr. Shen also delivered a keynote speech titled "System-on-Module on Glass Core Substrate (SoMoG)" on behalf of the Hi-CHIP Alliance, which includes key industry players such as Unimicron and ITRI, pointing out a key turning point in the automotive industry.12/15/2025【Smart Power Supply】Innovative Solution for DAC Control Bias Current
【Smart Power Supply】Innovative Solution for DAC Control Bias CurrentUSI's R&D team proposed a new "DAC Controlled Power Conversion Chip Bias Current Solution". This innovative technology not only solves the problems of precision, stability, and flexibility but also brings automation and remote-control capabilities, providing greater design freedom and reliability for next-generation electronic systems.10/21/2025From Experience to Precision: How AI Algorithms Enable Efficient RF Prediction Models (黄瓜视频破解版)
From Experience to Precision: How AI Algorithms Enable Efficient RF Prediction ModelsIn the EMS industry, even the smallest detail can significantly impact product performance and yield. The effectiveness of RF (Radio Frequency) circuit design directly determines the quality of wireless communication devices. Among the many challenges, impedance matching stands out as a critical factor in ensuring signal integrity and power transmission efficiency.09/11/2025 (黄瓜视频软件)Event｜DIGITIMES 2025 D Forum – USI Shares How Heterogeneous Integration Drives a New Landscape for MCU Applications
Event｜DIGITIMES 2025 D Forum – USI Shares How Heterogeneous Integration Drives a New Landscape for MCU ApplicationsOn August 8, 2025, the Father’s Day in Taiwan, a thought-provoking discussion on the future of intelligent control systems unfolded at the DIGITIMES-hosted “MCU Forum”. The event brought together leading players in system integration, including Texas Instruments, NXP, Renesas Electronics, and ITRI.08/15/2025Shielding Fence: SiP Technology at the Hair-thin level
"黄瓜下载" Shielding Fence: SiP Technology at the Hair-thin levelFollowing previous article on "Conformal Shielding" technology, we will continue to explain "Compartment Shielding" and how USI customizes miniaturized products for customers through two specially developed techniques: Trenching & Filling epoxy and Shielding Fence, achieving craftsmanship at the level of fineness between hairs.07/16/2025黄瓜视频在线 - Event |【Wide-Bandgap Semiconductor Technology Forum】: How Modularization and Miniaturization Revolutionize Server Power Efficiency
Event |【Wide-Bandgap Semiconductor Technology Forum】: How Modularization and Miniaturization Revolutionize Server Power EfficiencyOn June 12th, at the invitation of our industry media partner " Micro-electronics", John, our Chief Technology Officer, was honored to be one of the keynote speakers of the "Wide-Bandgap Semiconductor Technology Trends and Industrial Applications Summit Forum" to share the technology development in the field of AI, especially the topic of power supply, with the industry leaders.06/20/2025FEDS: A Key Engine Driving RF Automation Development
FEDS: A Key Engine Driving RF Automation DevelopmentBuilding upon the automation benefits of USI's FEDS platform, previously demonstrated in circuit layout review and power integrity simulation, this article is continuing to delve into FEDS's automated applications in the RF design domain and how it helps engineers overcome complexity and boost efficiency.06/09/2025"黄瓜视频旧版本" SiP Technology: Conformal Shielding and Compartment Shielding
SiP Technology: Conformal Shielding and Compartment ShieldingFor years, USI has been dedicated to researching and developing innovative manufacturing processes. Among these advancements, the continuous optimization and enhancement of electromagnetic shielding performance is a crucial aspect of SiP technology development. Extending from our previous articles on "System-in-Package" manufacturing, this article will delve into two major areas of shielding technology: Conformal Shielding and Compartment Shielding.05/09/2025Breaking the Bottleneck: The emergence of 3D packaging power modules
Breaking the Bottleneck: The emergence of 3D packaging power modulesFollowing up on the previous discussion on "The Dual Challenges of High-Performance Computing Systems," this article extends the discussion to potential solutions. To address challenges such as power consumption and heat dissipation, USI is implementing "3D packaging" technology for power modules. This approach enables compact integration of power modules within systems, enhancing power density and energy efficiency.03/25/2025
